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Self-bonding copper wire 0,71 mm, solderable, TI 155 °C, 15 g

SKU: Cul-0,071B155_15

Manufacturer: ETCOM

Availability: In stock

Delivery Time: 3-5 Tage

€10.14
Incl. 19% Tax, excl. Shipping Cost
OR

Kupfer-Backlackdraht 0,071 mm, lötbar, TI 155 °C, 25 g

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Self-bonding copper wire AWG 43 / 0,071 mm
Grade 1 (B155 = thermal class F (155 °C), bonds at low temperatures, solderable)
Diameter (conductor): 0,071 mm
Cross section: 0,003959 mm²
External diameter: from 0,085 mm to 0,094 mm
Breakdown voltage: 425 V
DC resistance: 4,318 ohm/meter


1 kg is 26,8 km.

Packaging: 15 g (ca. 0,335 km) on a coil former (click here), non-returnable

* true for Shipping within Germany. You can see delivery times for other countries on Shipping Information